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Punching Plate

Punching Plate is processed by stacking mica paper to required thickness and bonded with Silicone or Epoxy resin and set to plate form by applying hot press. The resin is fully cured to form dense and rigid sheets so that the sheets can be introduced to machining, shearing, punching or stamping to any required size without peeling.

The product is with high mechanical strength, high thermal resistance and excellent insulation properties.

They can be widely applied to reproduce punched insulating parts such as Plate, Separator, Disc, Spacer and Washers.

Typical Properties

Description

PLM 501

PLP 501

PLF 501

Mica Paper

Muscovite

Phlogopite

Synthetic

Binder Resin

Epoxy

Silicone

Silicone

Thickness

0.2~2.0 mm

0.2~2.0mm

0.2~2.0mm

Thickness

Tolerance

Average

0.02

 0.02

 0.02

Individual

0.03~0.04

0.03~0.04

0.03~0.04

Density g/cm2

2.0~2.5

2.0~2.3

2.0~2.2

Mica Content % App.

86~90

86~90

86~90

Compressibility

at 200 C

Under 300 kgf/cm2

0.5~1.5 %

0.5~1.5 %

0.5~1.0 %

Elastic Compression %

1.0~1.5

1.0~1.5

1.0~1.2

Plastic Deformation %

0.6~1.2

0.6~1.2

0.6~1.0

Punchability

Clean Edge

Clean Edge

Clean Edge

Dielectric Strength  kv/mm

> 20

> 25

> 30

Temperature Endurance

550 C

850 C

1250 C

 

Declaimer Statement

Technical Data, Properties and specifications related to products described or mentioned are based on practical experience and should be used as guidelines only. We are not responsible for any loss or damage.

Send mail to tough@datainfosys.net with questions or comments about this web site.
Copyright 2001 Tough International (P) Ltd.
Last modified: 01/14/02